Fabricating three dimensional structures through selective laser induced chemical etching as well as two-photon polymerization.

  Features  

Fused silica:

1. Maintaining 10  resolution over a 55 mm thickness range

2. Maximum workpiece size: 200 × 200 × 55 mm (X×Y×Z)

3. Maximum resolution: 1 μm

Photosensitive resin:

1. Maximum resolution: 120 nm

2. Maximum workpiece size: 200 × 200 × 2 mm (X×Y×Z)

  Applicable fields  

1. High-precision mechanics

2. Stereo Lithography appearance

3. Biomedical engineering